Electronics | Non-Contact Temperature Measurement during Development, Production and Incoming Inspection
Thermal Model Calculations
Infrared cameras are used in various phases of electronics development. Often, temperatures on a printed circuit board are simulated in advance using thermal model calculations. When measuring prototypes these model calculations can then be verified. Should any discrepancies arise, the data gathered during measurement can in turn be included in the simulations to improve the models. When measuring prototypes, components which consume an excessive amount of energy can be identified. This allows errors in the circuit design to be spotted at an early stage. The mutual interference of components on the circuit board can also be detected.
Process temperature: 30 °C (86 °F) to 120 °C (248 °F)
Quality Control
In production, assemblies from external suppliers are often used. To carry out incoming quality control of these assemblies, infrared measurement technology is also used here. This control can be carried out on all items, or by means of random sampling. Infrared cameras are also employed in the final inspection as part of the quality assurance of finished assemblies or circuit boards. This allows faulty components or assemblies, for example, to be identified during burn-in tests.
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